Mission Microwave has been tapped to supply the solid-state power block upconverters for Telesat’s Lightspeed Landing Stations. The contract involves their 100W units using gallium nitride tech for the 27.5-30GHz band. This is a core hardware win for a major new satellite internet constellation.
A new device shown at CES 2026 could let people with food allergies test their meals at the table. The Allergen Alert mini lab is a portable, battery-operated gadget that provides near-instant results for gluten and common allergens.
Xreal has announced an upgraded, more affordable version of its entry-level AR glasses. The Xreal 1S costs $449 and can convert 2D video to 3D on the fly using its built-in chip.
Asus has made it official: prices are going up. In a letter to partners, the company confirmed a “strategic” price adjustment for specific products, blaming AI-driven market demand and supply chain volatility. The changes are set to take effect before CES 2026 kicks off.
ASRock is expanding beyond motherboards and GPUs into the all-in-one liquid cooling market. Its new lineup includes a pumpless design that moves the pump away from the CPU block, plus standard models with LCD displays.
Asus has told telecom channels it will not introduce new smartphone models in 2026. The company insists it will maintain operations and support for existing devices, but the pause highlights the brutal challenges for PC brands in the mobile market.
A new report details Samsung’s 2025 roadmap, claiming the Galaxy S26 series will launch February 25 in San Francisco. Surprisingly, prices may hold steady. Lighter foldables are coming in July.
Samsung is shaking up its supply chain for its upcoming mid-range phone. The Galaxy A57 will reportedly feature a flexible OLED display, sourced in part from Chinese manufacturer CSOT.
Samsung announced its Exynos Modem 5410 can make native satellite voice calls, a first for smartphones. But the feature will likely be limited to South Korea and won’t be on the flagship S26 Ultra at all, creating a weird feature gap.
A former TSMC executive who recently joined Intel is under investigation after Taiwanese authorities found confidential chip documents at his home. TSMC has filed a lawsuit, alleging a potential breach of trade secrets and national security laws. Intel’s CEO claims the company respects competitor IP
